Japan Analytical Industry Co., Ltd.
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Recycling Preparative HPLC
Curie Point Pyrolyzer
Thermal Desorption
(Curie Point Purge & Trap Sampler)
Outgas Collector for Thermal Desorption
HM-04II
for Electorical parts ( 4 samples)
HM-10
for Electorical parts ( 10 samples)
HM-24
for Electrical parts ( 24 samples)
SW-8400/12400
for Silicon Wafer
FP- 9000
for Flat Panel

BO- HM- 01
Outgas Collector with Baking Function

TDV-04
For DVD
HD-2.5 /3.5
For 2.5h and 3.5h Hard Disk
HDD-500
For HDD
HD-3504/2506
For HDD, Electronic Parts, Devises and Components
O-HDD
For Operating HDD
AL-430
Air Sampler
OCM-6T
For structural components
AQ-200T
Liquid Sampler
CG-77
Combustion Gas Sampler
Cryogenic Sample Crusher
SW-8400/12400
for Silicon Wafer
     
Outline
6ƒand 8ƒ(SW-8400) or 12ƒ(SW-12400) wafer can be placed in the quartz oven.

Feature
•Quartz oven can be heated up to 500°C.
•Generated gas from only one side of the wafer can
  be trapped into PAT.
•The wafer can be inserted or removed with ease by
  the built-in hydraulic pump.
•The chiller unit, facilitates quick cool down, is
  installed as standard accessory.


Specification
♦Wafer size: 6ƒand 8ƒ(SW-8400)
  12ƒ(SW-12400)
♦Special O-ringl: Polyimide ring
♦Oven material: Quartz
♦Oven heating: Sandwich method
♦Heating temp.: Max. 400°C (up to 500° for baking)
♦Cooling method: Cooling water circulation
♦Purge gas: Normally nitrogen
♦Purge gas flow rate: 500 ml/min
♦Over heat protector Power supply:
  15 A, Sens.: 30 mA
♦Dimensions/weight:
  1140 W X 1106 H X 750 D (mm)/280 Kg
♦Power supply:
  AC 200 V (s.p.), 15 A / AC 100 V, 20 A