Outline
Developed for volatile components collection from only one side of the flat panel, such as LCD and PDP.

Feature
•Quartz oven can be heated up to 500¡üC.
•Generated gas from only one side of the wafer can
  be trapped into PAT.
•The flat panel can be inserted or removed with
  ease by the built-in hydraulic pump.
•The chiller unit, facilitates quick cool down, is
  installed as standard accessory.


Specification
♦Panel size: f 200 mm or less
♦Special O-ringl: Polyimide ring
♦Oven material: Quartz
♦Oven heating: Sandwich method
♦Heating temp.: Max. 400¡üC (up to 500°C for baking)
♦Cooling method: Cooling water circulation
♦Purge gas: Normally nitrogen
♦Purge gas flow rate: 500 ml/min
♦Overheat protector: Power supply:
  15 A, Sens.: 30 mA
♦Dimensions/weight:
  1140 W X 1106 H X 750 D (mm)/280 Kg
♦Power supply:
  AC 200 V (s.p.), 15 A / AC 100 V, 20 A